What method is used to minimize potential differences between conductive objects?

The method used to minimize potential differences between conductive objects is bonding. Bonding involves creating a conductive path between two or more conductive objects, which helps to equalize the electrical potential between them. This is particularly important in electrical safety and hazard prevention, as it reduces the risk of electrical shock or equipment damage that can occur when there are significant potential differences.

When two conductive objects are bonded, they are effectively tied together electrically, allowing any difference in charge to dissipate, thus preventing hazardous situations. This technique is commonly used in various applications, such as in electrical installations, to ensure that all components share the same electrical potential.

Other methods, such as grounding, serve a different primary purpose. Grounding connects an electrical system to the earth, serving to protect from overloads and electrical faults. Insulation involves using non-conductive materials to prevent electrical current from passing through, and separation physically isolates conductive objects to prevent contact. While all these concepts are significant in electrical safety, bonding specifically focuses on reducing potential differences between conductive items.